DAU - A Miba Group Company

Tgard™ 200 Series Insulator Material

Tgard™ 200 is a high performance interface pad.


Tgard™ 200 consists of a silicone/boron nitride composite. Tgard™200 interface pads are used when the lowest thermal resistance and highest dielectric strength are required. Tgard™ 200 is a fiberglass-reinforced material.
It is tough and strong, resulting in a high-tear, cut-through and puncture resistant product. Burrs pose no problem for this material. Tgard™ 200 will not dry out crack, or fail when pressured between mating parts.

Tgard™ 200 is available in 0.010" (0.25mm), 0.020" (0.51 mm) and 0.030" (0.75mm) thicknesses.