DAU - A Miba Group Company

Tflex™ 200 V0 Series Gap Filler Material

The Tflex™ 200 V0 Series is a very soft, free standing gap filler that is more compressible than most gap fillers.

Tflex™ 200 V0 combines good thermal conductivity of 1.1 W/m-K with high compressibility to produce low thermal resistance. The alumina filler allows Tflex™ 200 V0 to remain a cost effective solution where moderate thermal performance is acceptable. Tflex™ 200 V0 is naturally tacky and does not need an additional adhesive coating that can inhibit thermal performance.

Tflex™ 200 V0 is electrically insulating, stable from -40°C to 160°C and meets UL 94 V0 rating.