Unique silicone gel offers compliancy, thermal resistance.
The high rate of compliancy of Tflex™ 300TG allows the material to “totally blanket” the component, enhancing thermal transfer.
The material has a very low compression set enabling the pad to be reused many times. Tflex™ 300TG, in achieving its stellar compliancy, does not sacrifice thermal performance.
With a thermal conductivity of 1.2 W/mK, low thermal resistance can be achieved at low pressures.