DAU - A Miba Group Company

Tflex™ 300TG Series Thermal Gap Filler Material

Unique silicone gel offers compliancy, thermal resistance.

The high rate of compliancy of Tflex™ 300TG allows the material to “totally blanket” the component, enhancing thermal transfer.

The material has a very low compression set enabling the pad to be reused many times. Tflex™ 300TG, in achieving its stellar compliancy, does not sacrifice thermal performance.

With a thermal conductivity of 1.2 W/mK, low thermal resistance can be achieved at low pressures.