DAU - A Miba Group Company

Tflex™ 600 Series Gap Filler Material

Tflex 600 Series™ is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3.0 W/m-K. These outstanding properties are the result of a proprietary boron nitride filler in the composition.

The high conductivity, in combination with extreme softness, produces incredibly low thermal resistances. While extremely soft, Tflex 600 recovers to over 90% of its original thickness after compression under low pressure.

Tflex 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. Tflex 600 is electrically insulating, stable from -45ºC to 200ºC and meets UL 94HB rating.