DAU - A Miba Group Company

Tflex™ SF600 DF Series Gap Filler Material

Compliant Silicone-Free 2.8-3.0 W/mK Thermally Conductivity.


Tflex™ SF600 DF is a high performance, silicone-free thermal gap filler with a conductivity of 2.8 - 3.0 W/mK.

Tflex™ SF600 DF is designed for applications which are silicone sensitive.

This material is certified to UL 94V0 flammability rating.