DAU - A Miba Group Company

Tflex™ 700 Series Gap Filler Material

Tflex™ 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts.

Tflex™ 700’s unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance.

Tflex™ 700 is naturally tacky, and requires no additional adhesive coating to inhibit thermal performance. Tflex™ 700 is electrically insulating, stable from -45ºC thru 200ºC and meets UL 94V0 flame rating.