DAU - A Miba Group Company

Tpcm™ 670 Series Phase Change Material

Tpcm™ 670 is a high performance, inherently tacky, easy to rework phase change thermal interface material.

Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of Intel® mobile processors.

Tpcm™ 670 is optimized for Intel’s Penryn Quad-Core mobile processor.