DAU - A Miba Group Company

Tputty™ 502 Series Gap Filler Material

Tputty™ 502 Series is the best material for applications where large tolerance differences create the need for compression of interface material beyond 50% of its original thickness.

Tputty™ 502 flows to ensure low pressures on the components being cooled. In conjunction with outstanding compression characteristics, Tputty™ 502 has a high thermal conductivity that results in very low thermal resistance.

Tputty™ 502 is naturally tacky and requires no further adhesive coating, which would inhibit thermal performance. Tputty™ 502 has a hardness of 5 (Shore OO), is electrically insulating, and is stable from -45ºC to 200ºC.