DAU - A Miba Group Company

Tputty™ 504 Series Gap Filler Material

Tputty™ 504 is a soft silicone gel thermal gap filler ideal for applications where large gap tolerances are present.


The silicone gel is filled with a complex matrix of ceramic fillers to yield superior thermal performance.

Tputty™ 504 is soft and compliant transferring little to no pressure between interfaces. Because Tputty™ 504 has a higher viscosity than grease, it eliminates the bleed, separation and pump-out usually associated with grease. Bond line variances can also be more easily controlled with Tputty ™ 504 than with traditional thermal pads.

Tputty™ 504 can be applied like grease and is easily dispensable from a wide range of commercially available equipment including screen print, syringe and automated equipment.