DAU - A Miba Group Company

AIR COOLED HEAT SINKS



 
Modern high power semiconductors must be cooled efficiently to take advantage of their high current capabilities.

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LIQUID COOLED HEAT SINKS


 To provide the best heat dissipation DAU has already begun to develop highly advanced liquid cooling systems.

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HEATPIPES


A heatpipe comprises of a sealed evacuated metal envelope containing a porous capillary action wick linning.

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