DAU - A Miba Group Company

Tflex™ 500 Series Gap Filler Material

Highly Compressible Thermal Gap Filler with 2.8 W/m-K.

Tflex™ 500 is a highly compressible gap filler designed to provide excellent thermal performance while remaining cost effective. This soft interface pad conforms well with minimal pressure, resulting in little or no stress on mating parts.

Tflex 500’s unique silicone formulation has extremely low silicone extractables compared to other silicone interface materials and also meets NASA outgassing requirements.

Tflex 500 is naturally tacky, requiring no adhesive coating to inhibit thermal performance. Tflex 500 is electrically insulating, stable from -45ºC to 200ºC and meets UL 94V0 rating.